DSpace DSpace English
 

AIT Associated Repository of Academic Resources >
A.研究報告 >
A1 愛知工業大学研究報告 >
3.愛知工業大学研究報告 .B(1976-2007) >
29号 >

このアイテムの引用には次の識別子を使用してください: http://hdl.handle.net/11133/946

タイトル: サーモグラフィー法を適用したコンクリートの内部探査
その他のタイトル: サーモグラフィーホウ オ テキヨウシタ コンクリート ノ ナイブ タンサ
NON-DESTRUCTIVE EVALUATION OF INTERNAL DEFECT IN CONCRETE BY THERMOGRAPHY METHOD
著者: 山田, 和夫
YAMADA, Kazuo
発行日: 1994年3月31日
出版者: 愛知工業大学
抄録: In this study, the applicability of thermography method on the evaluation of inclusion embedded in a concrete was examined by the experiment and by the three dimensional finite element method for the heat conduction analysis. The relationships between the type and embedded depth of inclusion and the temperature distribution of concrete surface were discussed. Following results were obtained in this study : 1) The three dimensional finite element method for the heat conduction analysis is useful to examine comprehensively the effect of inclusion on the temperature distribution of concrete surface, because the analytical results agree well with the experimental results on the temperature distribution of concrete surface. 2) It is necessary to clarify the combined effects of solar irradiances, indoor and outdoor air temperatures on the temperature distribution of concrete surface, so as to evaluate exactly the inclusion embedded in concrete by the thermography method, because the temperature of concrete surface is very affected by these factors, even if the type and embedded depth of inclusion have the same conditions. 3) When the sol-air temperature is higher than the indoor one, the surface temperature at inclusion portion is higher than that of non-inclusion portion in the case of styrene foam as a inclusion, but the former becomes lower than the latter in the case of steel plate as a inclusion.
URI: http://hdl.handle.net/11133/946
出現コレクション:29号

このアイテムのファイル:

ファイル 記述 サイズフォーマット
紀要29号B(P135-140).pdf835.13 kBAdobe PDF見る/開く

このリポジトリに保管されているアイテムは、他に指定されている場合を除き、著作権により保護されています。

 

Valid XHTML 1.0! Powered by DSpace Software Copyright © 2002-2007 MIT and Hewlett-Packard - ご意見をお寄せください