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http://hdl.handle.net/11133/3503
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Title: | Al/Ni瞬間はんだ接合体の低熱抵抗化に関する研究 |
Other Titles: | Al/Niシュンカン ハンダ セツゴウタイ ノ テイネツ テイコウカ ニカンスル ケンキュウ Research on Reducing Thermal Resistance in Al/Ni Reactively Bonded Solder Joints |
Authors: | 金築, 俊介 KANETSUKI, Shunsuke |
Issue Date: | 23-Mar-2019 |
Publisher: | 愛知工業大学 |
URI: | http://hdl.handle.net/11133/3503 |
Appears in Collections: | 2018年度
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