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Please use this identifier to cite or link to this item: http://hdl.handle.net/11133/1628

Title: プラスチック用導電性充填剤としての研磨粉に関する研究(2) : 研磨粉充填エポキシ樹脂の熱安定性
Other Titles: プラスチック ヨウ ドウデンセイ ジュウチンザイ トシテ ノ ケンマフン ニカンスル ケンキュウ(2) : ケンマフン ジュウテン エポキシ ジュシ ノ ネツアンテイセイ 
Study on Grinding Chips as Conductive Filler for Plastics (2) : Thermal Stability of Epoxy Composite
Authors: 吉川, 俊夫
山田, 英介
中原, 崇文
YAMADA, Eisuke
NAKAHARA, Takafumi
Issue Date: 20-Jul-2003
Publisher: 愛知工業大学
Abstract: Epoxy resin composites containing steel grinding chips as a conducting filler was subjected to heat cycling tests in order to evaluate the thermal stability of electrical resistance. The effect of the content of grinding chips, magnetization and precure temperature in the curing process was examined and this resulted in finding the thermal stability to depend mainly on the precure temperature: the higher the precure temperature, the higher was the thermal stability. There was also shown to be a minimum value hi the electrical resistance of the composites at the temperature between 50 and 1OO℃.The ratio to the minimum resistance was found to depend mainly on the precure temperature. It has therefore been clarified that the thermal coefficient of the electrical resistance in the epoxy composites can be controlled by adjusting the precure temperature in the during process.
URI: http://hdl.handle.net/11133/1628
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